E pei o le Alumina ceramic wafer polesi ma safaira lapping tisiketi faʻaaogaina i le semi-conductive, faʻamalama taimane ma isi.
Fa'agasologa: O ituaiga uma o le fa'apolopolo ma le lapping process, e pei ole CMP chemical mechanical polishing, Mechanical Polishing, Precision Polishing.
Ole mama maualuga ma le tumau o vailaʻau
Malosi Fa'ainisinia Maualuga ma Ma'a'a
Tete'e A'a Maualuga
Tete'e Malosi maualuga
Maualuluga Tete'e e o'o i le 1700ºC
Fa'atinoga Fa'asagaga Fa'asa'o
Lelei Fa'atosina Fa'atinoga
O ituaiga uma o le Size 180,360, 450, 600mm etc
Igoa o oloa | 99.7 maualuga mama Alumina ceramic Polishing Lapping Discs |
Meafaitino | 99.7% alumina |
Tele masani | D180, 360, 450, 600mm, lapopoa faʻapitoa talia. |
Lanu | nifo elefane |
Fa'atatauga | Wafer ma Safaira CMP faagasologa i alamanuia semi-conductive |
Min. Poloaiga | 1Ata |
Vaega | 99.7 Alumina Ceramic | ||
Meatotino Lautele | Al2O3 anotusi | wt% | 99.7-99.9 |
Malosi | gm/cc | 3.94-3.97 | |
Lanu | - | nifo elefane | |
Suavai | % | 0 | |
Meatotino Fa'ainisinia | Malosi Fa'afo'i(MOR) 20 ºC | Mpa(psix10^3) | 440-550 |
Elastic Modulus 20ºC | GPa (psix10^6) | 375 | |
Vickers Malosi | Gpa(kg/mm2) R45N | >=17 | |
Malosi punou | Gpa | 390 | |
Malosi Tetele 25ºC | MPa(psix10^3) | 248 | |
Maloa gau (KI c) | Mpa* m^1/2 | 4-5 | |
Meatotino vevela | Fa'avevela vevela(20ºC) | W/mk | 30 |
Coefficient o le fa'alauteleina o le vevela(25-1000ºC) | 1x 10^-6/ºC | 7.6 | |
Tete'e Te'i vevela | ºC | 200 | |
Fa'aoga maualuga le vevela | ºC | 1700 | |
Eletise Meatotino | Malosi fa'a-dielectric (1MHz) | ac-kv/mm(ac v/mil) | 8.7 |
Dielectric tumau(1 MHz) | 25ºC | 9.7 | |
Volume Resistivity | ohm-cm (25ºC) | >10^14 | |
ohm-cm (500ºC) | 2×10^12 | ||
ohm-cm (1000ºC) | 2×10^7 |
Matou te talia fa'atonuga masani.
Afai e te fia iloa nisi faʻamatalaga o oloa, faʻamolemole lagona le saoloto faʻafesoʻotaʻi matou ma o le a matou tuʻuina atu ia te oe le oloa sili ona talafeagai ma auaunaga sili!